Hoenle LED Power Pen 2.0

The Hoenle LED Power Pen 2.0 is a very versatile, hand held UV curing device for hardening uv curable adhesives and sealants. It can be operated manually at a work station or laboratory bench. Generating 10,000 mW/cm² of UV intensity at 365nm wavelength or 16,000 mW/cm² intensity at 405nm wavelength, the Hoenle LED Power Pen is capable of curing UV adhesives and potting materials in very short cycle times. This is made possible by a lens system that focuses the UV radiation.

The Power Pen 2.0 delivers efficiency through low power consumption and minimal heat generation. This UV system offers 10 minute continuous operation without additional cooling. Life expectancy for the LED is 20,000 hours or more.

The Power Pen 2.0 from Hoenle is suitable for many applications in automotive, medical device assembly, PCB packaging, optical alignment, and glass bonding in general. It can also be used as a device for fluorescent excitation of genomic materials for testing and image processing. Whether for R&D or production, the Power Pen 2.0 is an excellent UV curing device.

Hand held uv curing device LED Power Pen 2.0 from Honle

Technical Data for Honle LED Power Pen 2.0

Peak wavelengths: 365/405 nm
UVA Intensity in 12 mm distance*:

10.000 mW/cm² at 365 nm
16.000 mW/cm² at 405 nm

Electrical power input: ca. 5 W
Mains supply: From external net 100-240V AC
Dimensions (Ø x length): 26 mm x 140,5 mm
Weight: 140 g
Continuous operation without additional cooling: max. 10 minutes

*  measured with Hönle UV-Meter 

System Solutions with Hoenle LED Power Pen 2.0 and Vitralit® adhesives:

UV Curable Acrylic Adhesives

Hoenle offers UV system solutions with uv curable acrylate adhesives from Panacol

more info >

UV Curable Epoxy Adhesives

System solutions with UV curable epoxy adhesives from Panacol are available

more info >

UV-LED Curable Adhesives

Unlike gas discharge lamps, LED light sources have a monochromatic light spectrum. Therefore, LED devices used for curing adhesive need a wavelength matched to the curing requirements of the particular adhesive used. 

more info >