Adhesives for SMD Assembly and Reflow Soldering

Before soldering, components with pin contacts or SMDs are often bonded to the PCB with fast-curing adhesive. This allows, for example, several capacitors, electrolytic capacitors and coils to be positioned on a circuit board to prevent their falling over or sliding out of position on the PCB. The secured components can then be reflow-soldered in a single work step, which saves time and speeds up production.

Panacol’s adhesives for reflow soldering have been developed specially to cure rapidly under UV light or at heat exposure. Once cured, they can withstand short-term exposure to higher temperatures, making them suitable for reflow soldering.

On request these adhesives are also available in red colour or with fluorescent pigment to facilitate quality and application monitoring. Their red colour or fluorescence allows the bond quality of every component to be easily inspected also in mass production.

Red dots of adhesive are easily applied via screen printing