Adhesives with Thermal Conductivity for Applications on PCBs

Adhesives with thermal conductivity are often used to dissipate heat from power electronics. Used to bond heat sinks, for example, their heat conductivity reduces thermal strain to prevent performance loss or failure of electronic components.

The thermally conductive adhesives are synthetic resins augmented with metallic or inorganic filler materials. The best thermal conduction coefficients can be achieved with metallic fillers such as silver or graphite. These, however, also make the adhesive electrically conductive, which is undesirable in many applications. To achieve thermal conductivity and electrical isolation at the same time, adhesives augmented with ceramic or mineral-based fillers must be used.

Compared to heat transfer compounds, thermally conductive adhesives have the advantage of securing components in addition to dissipating thermal energy.

Panacol offers a wide selection of thermally conductive adhesives: The spectrum ranges from epoxy resin-based single- and two-component adhesives of its Elecolit^® adhesives, which are thermally curing and have a high temperature resistance of up to 200°C, to acrylate-based UV-curing adhesives of the Vitralit^® series.

Adhesive with thermal conductivity is used for bonding heat sinks in the electronics industry