Encapsulation of Plastic Components

In many applications plastic components are manufactured and then encapsulated. A range of sealing compounds, encapsulants and potting compounds are available for different applications:

Flexible acrylates have a stress-equalizing effect and protect plastic components from impact and vibration. Rigid potting compounds, on the other hand, can reinforce and also carry heavy loads. 

UV- and LED-curing acrylic-based adhesives are especially suitable here due to their short curing times, which speed up production and therefore reduce production costs. A prerequisite is that the plastics are transparent and not impermeable to UV light. For joints with undercuts or shaded zones, dual-curing adhesive systems are used. These are thermally cured following initial UV curing. Non-transparent substrates can be bonded with epoxy adhesives that cure thermally or at room temperature.

Dual-curing adhesives are also employed for particularly thick adhesive layers. Alternatively, thick layers can be cured with longer-wavelength light (about 405 nm LEDs), with which layers of several millimetres’ thickness can be cured.

Blue uv-moisture curing adhesive is used as encapsulant for electronic components