Sensor Technology
It is impossible to imagine the automotive and vehicle industry without sensor technology. Sensors detect physical or chemical properties such as temperature, humidity, pressure, force or acceleration and convert them into an electrical signal that can be further processed. In some cases, sensors must function in critical environments without failure and for as long as possible. Panacol adhesives are used in sensor technology to fix and/or protect components, for shielding, heat dissipation or electrical contacting.
Sensor technology is used both in the interior and exterior of vehicles. Sensors must be adapted to the environment and withstand temperature fluctuations, humidity, media resistance, vibrations and other conditions. Panacol adhesives, sealants and potting compounds are ideally suited for this purpose, as they not only protect but also bond sensor components. Sensors in outdoor areas are also exposed to humidity and rain, where glob tops or pottings with low ion content from Panacol offer additional protection against corrosion.
In addition to the environment, other factors such as substrates, surface conditions or thermal expansion coefficient play a decisive role in the selection of the potting or connecting compound. The choice of process can also contribute significantly to product recommendation. UV-curing products in particular are an efficient and fast method for casting or bonding. The viscosity settings can be continuously optimized and adjusted here. Panacol offers competent advice based on many years of know-how and a wide range of products for this area.
Material in possible shadowed areas can be safely cured by dual-curing products. Here, the adhesive on the sensor or component is first fixed with UV light. In a second step, the adhesive then cures with heat or moisture in the non-exposed areas.
A Structalit® adhesive is used as potting on a sensor board.
Download:
Bonding Solutions for Sensors:
Glob Tops and potting compounds are used to protect sensors against corrosion and other environmental and chemical influences. Dual-curing adhesives are available for shadowed areas.
Products from the Elecolit® product range can be used for electrical contacting of sensors, components and other vehicle electronics. These electrically conductive adhesives cure even at low temperatures, so that they are used instead of soldering, especially on heat-sensitive components. In addition, adhesives are more flexible and therefore enable stress-free connections.
Panacol has developed special thermally conductive adhesives and silicone-free thermal interface materials (TIM) for heat dissipation in heat-sensitive components. These adhesives are both thermally conductive and electrically insulating.
Sensitive sensors often need to be shielded against electromagnetic or electrostatic radiation in order to operate without interference. Magnetic fields or radio waves can also restrict the functioning of sensors or interfere with signals. For this purpose, conductive adhesives can be used.
In the following table you will find a selection of adhesives suitable for the various applications in sensor technology. Further products and customer-specific solutions are available on request.
Technical data sheets can be downloaded by clicking on the adhesive name.
Adhesive | Applications | Viscosity [mPas] | Base | Curing* | Properties |
---|---|---|---|---|---|
Vitralit® UV 2113 |
Potting Sealing Protection of sensitive components |
19,000-32,000 (Rheometer, 25°C, 10s^-1) | acrylate |
UV VIS |
Acrylate hybrid superior strength low thermal expansion impact resistant low shrinkage resistant to soldering stress excellent flow properties |
Vitralit® 1600 LV |
Glob Top Potting Material Encapsulation of electronic components Conformal Coating |
3,000-5,000 | epoxy |
UV secondary heat cure |
Very high Tg low water absorption low ion content very high chemical resistance |
Vitralit® 1671 | Frame material for frame & fill applications | 9,000-14,000 (Rheometer, 10s^-1) | epoxy |
UV secondary heat cure |
Stable frame compound high ion purity electronic grade adhesive high temperature conductivity low water absorption UL94 HB test passed |
Vitralit® 1680 |
sealing compound as glob top or filler encapsulation |
5,000-8,000 | epoxy | UV |
Very high resistance to heat and humidity electronic grade adhesive low ion content suitable for chip protection |
Vitralit® 2028 |
Conformal Coating, Encapsulation of electronic components |
160-300 | epoxy |
UV secondary heat cure |
Dry surface after UV-curing autoclavable excellent chemical resistance scratch resistant coating |
Vitralit® 4731 |
Bonding of flexible components; Attaching components on PCBs |
900-1,500 (LVT, 25°C, Sp. 3/30 rpm) | acrylate |
UV VIS |
Dry surface after curing, biocompatible: certified to USP Class VI and ISO 10993-5 standards |
Vitralit® 4731 VT |
Bonding of flexible components; Attaching components on PCBs |
4,000-8,000 | acrylate |
UV VIS |
dry surface after curing flexible and tear-proof excellent adhesion to many plastics |
Vitralit® 6104 | Encapsulation of electronic components | 3,000-8,000 | acrylate |
UV secondary heat cure |
Very high adhesion to metals and sintered materials |
Vitralit® VBB-1 | Encapsulation of electronic components | 1,000-1,500 | acrylate |
UV VIS |
Elastic high peel strength optically clear very flexible suitable for potting |
Vitralit® UD 5180 |
Fixing components, sensor encapsulation in automotive/aerospace industry, bonding lenses, bonding plastic parts and plastic housings |
4,000-6,000 | epoxy |
UV secondary heat cure |
Perfect solution for bonding flexible circuit paths resistant to reflow processes grey color |
Elecolit® 3025 |
Bonding heat-sensitive components; Heat dissipation |
80,000-90,000 Mix, 25,000-35,000 part A, 60,000-70 000, part B, (Rheometer, 25 °C, 10s^-1) | 2 component epoxy |
thermal room temperature |
electrically conductive (ICA) thermally conductive |
Elecolit® 3661 | Heat dissipation | 20,000-40,000 | epoxy | thermal |
electrically conductive (ICA) thermally conductive stable flexible |
Elecolit® 6601 |
Sensor bonding Dissipation of heat Potting |
12,000-20,000 (LVT, 25 °C, Sp. 4/6 rpm) | epoxy | thermal |
thermally conductive, solvent-free, white color, excellent bonding to metals, very good flow properties |
Elecolit® 6603 | Dissipation of heat | 95 000 - 115 000 (LVT, 25 °C, Sp. 4/3 rpm) | epoxy | thermal |
thermally conductive grey color very good adhesion to metal excellent flow properties |
Elecolit® 6616 | Vibration and shock resistant bonding of sensors and components | 50,000-120,000 (Rheometer, 25 °C, 10s^-1) | 2 component epoxy |
thermal room temperature |
thermally conductive black color |
Structalit® 5894 M |
Glob top encapsulation Encapsulation of electronic components Bonding of electronic components Fill material for frame&fill |
20,000-30,000 (Rheometer, 25 °C, 20s ^-1) | epoxy | thermal |
Black color excellent flow properties filling material for frame and fill applications on PCBs, very high resistance to heat and chemicals |
Structalit® 8801 |
Attaching components on PCBs, Encapsulation of electronic components,, Encapsulation of plastic parts, Potting material |
30,000-45,000 (LVT, 25°C, Sp. 4/6 rpm) | epoxy | thermal |
Resistant to oils, grease and fuels excellent flow properties beige color certified to ISO 10993-5 standards |
Structalit® 8838 |
Attaching components on PCBs; Encapsulation or potting of electronic components |
6,500-7,500 (Rheometer, 25°C, 20s^-1) | epoxy | thermal |
Black color flexible potting compound excellent flow properties |
*UV = 320 - 390 nm VIS = 405 nm