Thermally Conductive Adhesives
Thermal adhesives are synthetic epoxy resins augmented with metallic or inorganic filler materials. The best thermal conduction coefficients can be achieved with metallic fillers, such as silver or other metals. These, however, also make the adhesive electrically conductive, which is undesirable in many applications. To achieve thermal conductivity and electrical isolation at the same time, adhesives augmented with ceramic or mineral-based fillers must be used.
Thermal adhesives are often used for thermal management to dissipate heat from power electronics. Used to bond heat sinks, for example, their heat conductivity reduces thermal strain to prevent performance loss or failure of electronic components. Thermal conductive adhesives are also used as encapsulants for temperature sensors for enclosures or reactors.
Compared to heat transfer compounds, thermal adhesives have the advantage of holding or mounting components in addition to dissipating thermal energy.
With its Elecolit® range Panacol offers a wide selection of thermal adhesives: The spectrum ranges from epoxy resin based single- and two-component adhesives – which are thermally curing and have a high temperature resistance of up to 200°C – to dual-curing UV systems of the Vitralit® series that are curable under UV light to the extent that they can secure structures, with final curing taking place through application of heat.
Thermally conductive adhesives are mainly used for
Thermally conductive adhesives are used for bonding heat sinks onto PCBs.