Thermal Management in Electronics

Thermally conductive adhesives are often used for themal management to dissipate heat from power electronics. Used to bond heat sinks, for example, their heat conductivity reduces thermal strain to prevent performance loss or failure of electronic components. Thermally conductive adhesives are also used as encapsulation compound for temperature sensors for enclosures or reactors. 

Adhesives with thermal conductivity are synthetic resins augmented with metallic or inorganic filler materials. The best thermal conduction coefficients can be achieved with metallic fillers such as silver or graphite. These, however, also make the adhesive electrically conductive, which is undesirable in many applications. To achieve thermal conductivity and electrical insulation at the same time, adhesives augmented with ceramic or mineral-based fillers must be used. 

Panacol has developed highly efficient silicone-free 2-component TIMs (thermal interface material) especially for dissipating heat from chips and sensors. The heat dissipation significantly increases the service life of chips and sensors.

Compared to heat transfer compounds, thermoconductive adhesives have the advantage of holding or mounting components in addition to dissipating thermal energy.

Panacol offers a wide selection of thermally conductive adhesives for thermal management: The spectrum ranges from epoxy resin based single- and two-component adhesives of the Elecolit^® series, which are thermally curing and have a high temperature resistance of up to 200°C, to acrylate-based UV-curing adhesives of the Vitralit^® line.

Thermally conductive adhesive is used for bonding heat sinks in the electronics industry