Frame&Fill Adhesives
Frame-and-fill processes are used to protect highly sensitive areas or sensitive information on electronic circuit boards. In the first step, a high-viscosity barrier – the so-called frame – is applied. In the next step, this area is filled with low-viscosity filler material – the fill. Frame and fill offers two primary advantages: Barrier and potting (fill) heights can be kept to a minimum, and the frame and fill combine to form a homogeneous protective coating. With this precise process, specific areas on the PCB can be protected from mechanical and environmental impact factors.
Structalit® frame&fill adhesives from Panacol are formulated to be completely compatible with each other. Both materials can be optimally dispensed wet-on-wet. The highly thixotropic frame prevents the lower viscosity fill from migrating into undesired areas on the PCB. The frame and fill are then cured in a single step.
Structalit® brand frame&fill adhesives are black, one-component epoxy resin adhesives that cure thermally. They have a high glass transition temperature, are extremely scratch and chemical resistant, and do not bleed.
Panacol also offers Vitralit® brand adhesives, which are translucent, UV-curing epoxy-based frame&fill materials. These UV-curable adhesives can likewise be dispensed wet-on-wet and then cured in seconds under UV or UV LED light. These UV epoxy resins are equally robust against temperature and environmental influences. Some of these UV-curable adhesives can be thermally post-cured to ensure that the adhesive also polymerizes reliably in shadowed areas or when applied in thicker layers. The advantage of UV-curable frame&fills is their fast curing at low temperature. Rigid and flexible circuit boards containing temperature-sensitive components can be processed in-line, in a continuous production flow.
Panacol offers frame&fill adhesives with a low ion content with less than 20 ppm, making them particularly suitable for chip encapsulation on electronic circuit boards.
A stable "frame" is filled with low-viscosity fill material and results in a homogeneous protective coating of sensitive components
In the following tables you will find a selection of Panacol adhesives suitable for Frame&Fill applications. Other products or customized solutions are available on request. Technical data sheets can be downloaded by clicking on the adhesive name.
Frame&Fill adhesives for semiconductor applications (< 20 ppm)
| Adhesive | Application | Viscosity [mPas] | Base | Curing | Properties |
|---|---|---|---|---|---|
| Structalit® 5704 | Frame-material for Frame&Fill | 60,000-100,000 (Rheometer, 25 °C, 10s^-1) | epoxy | thermal |
black color stable frame suitable in combination with Structalit 5717-5721 no bleeding very low ion content (<10ppm) high glass transition temperature |
| Structalit® 5717 | Fill-material for Frame&Fill | 3,000-8,000 (Rheometer, 25°C, 10s^-1) | epoxy | thermal |
Black color, very good flowability High glass transition temperature No bleeding Very low ionic content (<10ppm) Suitable for semiconductors |
| Structalit® 5719 | Fill-material for Frame&Fill | 7,000-11,000 (Rheometer, 25°C, 5s^-1) | epoxy | thermal |
Very good flowability High glass transition temperature No bleeding Very low ionic content (<10ppm) Suitable for semiconductors |
| Structalit® 5720 | Fill-material for Frame&Fill | 10,000-15,000 (Rheometer, 25°C, 5s^-1) | epoxy | thermal |
Very good flowability High glass transition temperature No bleeding Very low ionic content (<10ppm) suitable for semiconductors |
| Structalit® 5721 | Fill-material for Frame&Fill | 15,000-20,000 | epoxy | thermal |
Very good flowability High glass transition temperature No bleeding Very low ionic content (<10ppm) Suitable for semiconductors |
Frame&Fill adhesives for electronics applications (< 900 ppm)
| Adhesive | Application | Viscosity [mPas] | Base | Curing | Properties |
|---|---|---|---|---|---|
| Structalit® 5891 T | Frame-material for frame&fill | 80,000-150,000 | epoxy | thermal |
Black color stable frame material, can be applied wet-in-wet with filling material, suitable for frame stacking stable edges resistant to shocks |
| Structalit® 5791 | Frame-material for "Frame&Fill" | 45,000-65,000 | epoxy | thermal |
black color excellent shock resistance low halogen content <900 ppm |
| Structalit® 5893 | Fill material for frame&fill | 6,000-10,000 (Rheometer, 25°C, 10s^-1) | epoxy | thermal |
Black color excellent flow properties filling material for frame&fill applications high resistance to heat and chemicals certified to ISO 10993-5 standards |
| Structalit® 5894 M |
Glob top encapsulation Encapsulation of electronic components Bonding of electronic components Fill material for frame&fill |
20,000-30,000 (Rheometer, 25 °C, 20s ^-1) | epoxy | thermal |
Black color excellent flow properties filling material for frame and fill applications on PCBs, very high resistance to heat and chemicals |
UV-curable Frame&Fill adhesives (< 20 ppm)
| Adhesive | Application | Viscosity [mPas] | Base | Curing* | Properties |
|---|---|---|---|---|---|
| Vitralit® 1671 | Frame material for frame & fill applications | 9,000-14,000 (Rheometer, 10s^-1) | epoxy |
UV secondary heat cure |
Stable frame compound high ion purity electronic grade adhesive high temperature conductivity low water absorption UL94 HB test passed |
| Vitralit® 1650 | Fill for frame&fill | 3,000-5,000 | epoxy | UV |
Electronic grade low ion content suitable for chip protection UL94 HB test passed |
| Vitralit® 1657 | Fill for frame&fill | 5,000-15,000 | epoxy | UV |
Low ion content excellent chemical resistance low water absorption suitable for covering open bonded chips |
| Vitralit® 1680 | Fill for frame&fill | 5,000-8,000 | epoxy | UV |
Very high resistance to heat and humidity electronic grade adhesive low ion content suitable for chip protection |
| Vitralit® 1691 | Fill for frame&fill | 20,000-40,000 | epoxy |
UV secondary heat cure |
black color high ion purity electronic grade adhesive high temperature resistance fast surface curing with UV light |
*UV = 320 - 390 nm